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Carrier Global Corporation, global leader in intelligent climate and energy solutions, is committed to creating solutions that matter for people and our planet for generations to come. From the beginning, we've led in inventing new technologies and entirely new industries. Today, we continue to lead because we have a world-class, diverse workforce that puts the customer at the center of everything we do.

About the role

Carrier is seeking recent graduates in software, electrical, mechanical, systems, and other engineering disciplines with strong academic performance and demonstrated leadership to join our Engineering Leadership Program (ELP) .

This competitive program offers three eight‑month rotations within various Carrier business units, providing hands‑on experience, accelerated development, and meaningful contributions to strategic projects.

ELP rotation locations will be based in Santa Catarina , with the possibility of rotating across different Carrier buildings and leaders during the first two years.

As part of Carrier's Disruptive Climate Solutions and Integrated Energy Systems organization, you will contribute to advanced research, innovative technologies, and sustainable solutions that shape the future of our products and services.

Key Responsibilities

As an ELP Engineering Associate , you'll be responsible for:

• Collaborating with team members across different facilities to deliver assigned projects.

• Managing your own workflow, ensuring timely and high‑quality execution.

• Adapting to diverse teams with a continuous learning mindset.

• Supporting electronics engineers with product enhancements and modifications.

• Updating engineering drawings and bills of materials.

• Participating in cost‑reduction and quality‑improvement initiatives.

Requirements

We are looking for people who are proactive, analytical, adaptable, and eager to learn . If this sounds like you, we'd love to hear from you.

As a minimum, you must have:

• Bachelor's degree in Electronics, Mechatronics, Digital Systems, or Robotics Engineering .

• Academic GPA ≥ 90 .

• To be eligible, you must be graduating in May, August, or December 2025 , and be available to start the Leadership Program in early 2026 .

• Relevant internship or co‑op experience.

• Ability to read, understand, and troubleshoot electronic schematics.

• Familiarity with Microsoft Office tools.

Although not necessary, it would be nice if you have:

• Experience using Altium or similar PCB design software.

• Knowledge of programming languages such as C++, Python, Java or similar.

• Experience in software quality assurance for embedded systems.

• Knowledge of manual, automated, and regression testing.

• Practice with automation tools such as Selenium or Robot Framework .

• Familiarity with communication protocols: Modbus, RS485, BACnet .

• Experience with version control (Git) and issue tracking (JIRA, DevOps).

• Knowledge of refrigeration products (preferred but not required).

Soft Skills

• Proactive and results‑oriented mindset.

• Strong written and verbal communication skills across diverse audiences.

• Strong organizational, analytical, and problem‑solving abilities.

• High adaptability and attention to detail.

• Ability to manage multiple priorities effectively.

• Initiative to identify and lead continuous improvement opportunities.

Benefits

We are committed to offering competitive benefits and continually enhancing them.

• Health insurance for peace of mind and body.

• Career development and professional growth opportunities.